Nexus will have a table top display at the SMART Group European Conference next month on the 18-19th September in Thame, England.
The conference is titled The Big Zero Conference – Design and Build Reliability and if your goal is O% rework, O% field failures SMART Group’s exciting 2 day conference is for you! This year we are concentrating on design, production and reliability of electronic assemblies with particular emphasis on new components and assembly technologies.
Topics include:
Design for manufacture and reliability of high density devices
Design, fabrication and reliability of advanced circuit boards
Solder paste application and alloy selection for high density interconnection
Soldering of high density packages
Cleaning and conformal coating
Component packaging developments
Thermal management
Mitigation techniques for tin whiskers
Reliability and testing regimes
Novel materials, bonding, processing, packaging techniques and technologies
Design, fabrication and reliability of advanced circuit boards
Solder paste application and alloy selection for high density interconnection
Soldering of high density packages
Cleaning and conformal coating
Component packaging developments
Thermal management
Mitigation techniques for tin whiskers
Reliability and testing regimes
Novel materials, bonding, processing, packaging techniques and technologies
Come and listen to industry experts and take time to work with Nexus on your conformal coating requirements. For further details on the conference click SMART Group European Conference on Packaging, Assembly and Reliability plus Table Top Exhibition
"Expertise, Right Across the Board" 